18 W a pair of central processor suitable and thin occupation of land of circle
Advanced miniature apparatus Limited Company lengthen BGA two double-core, 18 W hot to design power (TDP) Imbed customer its ASB1 processor of the platform.
The power cooling system that TDP represents the largest quantity in a computer is demanded to dissipate.
AMD Turion Neo X2 processor model L625 and AMD Athlon Neo X2 processor model L325 are used for with a low power envelope and used and is imbedded the friend Good BGA wraps up and offers PC performance.
It should be in the first of the products based on processor of introduction that AMD says and imbeds the systematic provider IBASE and IEI technological company.
Suitable for traditional embedded application, for example the single board is calculated and thin customer’s system by the solution of customer who is imbedded, and sell the pavilion helping oneself of the marks of machine and figure, the market clicked.
BGA wrap up, should reduce dependability to be thin to dispose and let low height use for, make, become possible problem of system in strong environment, enclose the occupation of land small-scaly.
When having AMD 780 E or M690E chip group concurrently, imbed the system, the designer can utilize an intact solution based on x86.
All AMD imbeds the products and is offered by the component longevity of 5 years of standard industry.
” Because of AMD Athlon Neo X2 processor, AMD leave 3 W on us until central punch of predecessor improved first new CPU choose to increase on the processor consumption singly, ” Manager of production department, IBASE technology, Dwight Looi says. ” There are not 18 sets of W processor power efficiency on the market offering our users precisely, the combination of performance the same as value, for employing enabling it embeddedly as the natural choice of us. ”
