Break IC (climb the roadblock) 5 kind method
Slice is climbed in the future several years the lieutenant general continues, but there are several that surface IC manufacturers of challenge.
Mark in Intel Company is rich, course building and comprehensive Intel senior colleague and director, slightly state challenging and potential solution at the meeting of the international solid-state circuit. Enumerate 5 richly Stumble blocksr challengesor 32 nanometers of nodes mainly and in the distant place:
1. Imitate or lithographic printing skill
Question: Compared with IC characteristic size, the wavelength has been regulated in a slower rate all the time.
Current solution: ” Determine to improve technology, for example the correction that the vision is close to, move the face guard and soak in the lithographic printing skill, have already been recommended producing and bringing us to 32 nanometers. But even use these to improve, the overall arrangement is limited, such as the one-way characteristic, gridded overall arrangement and line of the restriction are combined with the space, must be adopted gradually. ”
The solution in the future: ” The lithographic printing skills of double technology and calculation imitated are to choose to be investigated to continue 16 nanometers to 22 nanometers and perhaps to climb, count and take the place of before the ultraviolet lithographic printing skill extremely can plan to offer the prominent wavelength to cut down and determine to improve. ”
2. The transistor is chosen
Question: Climb classically because the oxide seepage of the door is over at the beginning of 21st century.
Current solution: ” Strain silicons, the mediums of high k and metal doors are important innovations that has already allowed MOSFET density, at the power of losing, performance and energy efficiency can let, watch in the past continuing, improving as traditional technology of climbing. ”
The solution in the future: ” The project of ground floor utilizes gaufrettes to improve the channel mobility of the pence, but it is impossible to offer any interests for the apparatus. Multi-door transistor (such as FinFET) ,Three doors and offering improved electrostatics in the apparatus around the door, steeper subsidiary threshold slopes, but the bitterness that can be resisted by higher parasitic electric capacity and parasitic one.
” III-IV straits material like InSb, InGaAs and InAs are used for offering high and put through at the pace of the low working voltage like that because the mobility of porter increasing is very hopeful, but before a real CMOS solution will got ready, challenge and keep.
3. Join and choose each other
Question: The new solution is demanded to reduce resistivity and other problems.
Current solution: The course uses the pence in copper to join each other today, low k and other technology that can make join and draw each other in proportion in order to take the place of the rate of 0.7 x each time.
The solution in the future: ” Offer slice of the high density to join each other with 3 D slice piled up combining together through the silicon road crackedly. The downward trend of 3 D one piled up includes the process cost that is increased so, let road wear it and offer ability and pile from this piece divided by to the slices of inoperative silicon challenge on reduce phlegm and internal heat.
” Visual bandwidth block technology can spend, combine development that photon learn silicon logic effectively. The ones that used the vision to be suitable for signalling may be far on one because those difficulties and gave those size of the requirement each other with drawing and only accepting transmitters together in proportion in the future Join. ”
4. Imbed memory
Question: The high density memory is needed in the apparatus of today beyond SRAM.
Current solution: Traditional 6 T SRAM cabin are used in the processor and other products.
The solution in the future: ” Use, attached to typing blue traditional, eDRAM and glimmer choice of memory, flow health cell, the phase place changes memory and looks for and scans and ascertains that choosing all to offer more enormously in memory, the density can be offered more than 6 T SRAM cells. But and a logic course combine together and damage first or another one may be one novel memory course together at single gaufrette together It is difficult. ”
5. System integration
Question: Can be while only making more complicated edition of the same systematic part as them, bring light transistor no enough.
Current solution: ” The new era of the microprocessor regulated widely utilizes energy efficiency even more, power is managed, it is a lot of cores to offer, the resembling of many cores and multi-functional products, the circuit that suitable for and SoC appearance. ”
The solution in the future: ” Because we consider it is comprehensive that the best road accept and make higher level from electronic world, we may consider being born (such as the human brain) Example offered .
With fighting downheartedly
Though layoffs Intel recently claims to plan to cost 7 billion dollars fabs building or expanding it in U.S.A. in the following two years.
Invest in 32 nanotechnology used for using it effectively of fund, this will be produced recently. Intel is trying every possible means to keep the leading competitor’s advanced miniature apparatus Limited Company, this plan goes to fabless.
Intel says that making the investment will do while having in Oregon, produce the place in Arizona and New Mexico. It will be in those positions of a total Intel labourer who exceeds 45, 000 employees in U.S.A., support about 7, 000 jobs partly.
Intel, while producing more than 75% its sale abroad, probably goes on in 75% of its semiconductor which U.S.A. produces. Meanwhile, probably the research of the company, with developing 75% of expenses and capital investment by U.S.A.’s manufacture.
Be used first Intel processor built of 32 nanotechnology to be codenamed ” Westmere, ” And will be used in tabletop and major system of moving initially. Westmere production will be improved to begin in 2009. Other 32 nanometers of products will be followed in 2010.
” We are investing in the most anterior our country where U.S.A. is keeping Intel and improving, ” Otellini, Paul of Intel CEO, say, speak, announce, invest to 10 times in Washington while one released before February are stated.
Still, Intel cuts down the production cost in the economic downward trend too. Say as slices of giant it close two old fabs and 3 IC at the assembling factory last month, other shoes have already dropped.
Intel said recently too that it plans to close its packaging IC gives to Shanghai, China suggests that will dispel 2, 000 jobs, according to the report.
Recently, Intel says Q4 08 net income drops to 234 million dollars, or 4 fen per share, it lose with one 1,200 million yuan relate to strike hard it to interest Clearwire the investments fairs of Company have
Announce per share of pure profits of 2,300 million dollars or 38 points in 1/4Intel that can be compared before annual. The income in 3 months finished 27 in December, 2008 sink, to 8,200 million, prophesy like before one that is from 2007 or four 1107 a hundred million that can compare so downward 23%.
