Ramtron installs F RAM course technology in IBM apparatus
Ramtron international company already entered one and cast factory’s service agreement with IBM. The company plans to install ferroelectric RAM (F RAM) of Ramtron In Berrington of IBM, the semiconductor process technology of the Vermont gaufrette of the production equipment. Once installation, will cast the factory and offer as a setting-up that is given the new introduction of saving the cost high-performance F RAM semiconductor products newly.
” We expect, increase production capacity cast factory’s relation through help F RAM semiconductor we of demand of products in Ramtron increased to meet together with IBM, ” Ramtron chief operating officer, Bob Djokovich says. ” We are glad to help to make the enlargement of F RAM products quotation of Ramtron easy, ” John DiToro says, in IBM system and VP of semiconductor which the technological group produce. ” This series cast the factory to serve IP lump that can be offered and can offer much product development flexibility for Ramtron enormously through IBM. We expect to cooperate in helping the company to reach its production and product development goal with Ramtron. ”
Ramtron expects to produce and produce the gaufrette 0.18µm gaufrette production process in IBM first during 2010. IBM will make Ramtron 3 cast to the factory supplier with Fujitsu Ltd and Texas Instruments Inc. for F RAM semiconductor products of it together
Move ahead simultaneously with casting factory’s agreement, Ramtron confirms one 11 million dollar as the apparatus of the loan through the bank of Silicon Valley capital and course of providing with funds of development cost, relevant relation with casting factory of IBM. In addition, Ramtron is cooperating with bank of Silicon Valley company’s rotatory credit limit of extension (LOC) Until March of 2012, and increase and can be got and amounted to the fund of 5 million dollars under LOC. Ramtron has LOC now to consider U.S. dollar 4 million most. Up till now, Ramtron has had no amount of money not repaid on its credit limit. The apparatus of the new loan is expected to close during Q1 09.
